ZDSCC200612 Less Hard
- Model: ZDSCC200612 Less Hard
- Application: Used for low-temperature resistance solder joint protection, ABS material fixed bonding, etc.; has excellent adhesion to glass, metal, and plastics. The glue can be cured under weak light intensity, has a fast curing speed, and has good surface drying.
- Appearance: paste
- Viscosity /cps: 10000~55000£¨paste£©
- Hardness/Shore: 75-85A
- Curing energy mj: 500mj£¨50W LED light£©
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